Materials & Process Development
Characterizing materials, optimizing fabrication processes, and designing experiments to advance reliability and performance of flexible and 3D-printed electronics.
Advanced Packaging Engineer & Materials Scientist
I develop processes, using novel materials and fabrication techniques for flexible hybrid electronics, RF devices, and high-power packaging. My work spans printed electronics, additive manufacturing, laser processing, reliability testing, and translating research into scalable manufacturing solutions.
Advanced Packaging & Integration
Integrating rigid components onto flexible substrates, developing low-temperature bonding solutions, and enabling complex RF and power module assemblies.
Collaborative R&D & Manufacturing
Working with industry partners to translate research into manufacturable, reliable solutions with applications in aerospace, automotive, and RF communication.